IC test board
Max board thickness：6.0mm
Max aspect ratio：25:1
Max gold thickness ：80 u''
Warpage：≤4‰
High-density multilayer board
Min line width/space ：3mil
Min hole size：0.2mm
Impedance control tolerance：±10%
Max layer count ：56
Ceramic based PCB
Min hole size ：0.1mm
Metallization Process：DPC, DBC, COB
Finish board thickness：15um-200um
Surface finish：ENIG, Immersion silver
Blind & Buried vias PCB
Layer count：12 layer
Aspect ratio：12
Min hole size：0.15mm
Line width/space：4/4mil
Blind vias ：1-2/1-3/1-4/1-5
Partially embedded AIN board
Material：AIN
Embedded Ceramic size ：20*20（mm)
Professional technical support for thermal management：
Rigid-flex PCB
Flexiable layers ：8
Max layer count ：16
Min line width/space：4mil
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mgytea.com
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